Beckhoff CB4053 Manual de usuario Pagina 4

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Contents
page 4 Beckhoff New Automation Technology CB4053
6.3.1 IDE Channel 0 Master/Slave ............................................................................................... 44
6.4 Advanced BIOS Features ........................................................................................................... 45
6.4.1 CPU Feature ....................................................................................................................... 47
6.4.2 Hard Disk Boot Priority ........................................................................................................ 48
6.5 Advanced Chipset Features ........................................................................................................ 49
6.6 Integrated Peripherals ................................................................................................................. 50
6.6.1 OnChip IDE Devices ........................................................................................................... 52
6.6.2 Onboard Devices ................................................................................................................. 53
6.6.3 PCI Express Root Port Function ......................................................................................... 54
6.6.4 USB Device Setting ............................................................................................................. 55
6.7 Power Management Setup .......................................................................................................... 56
6.7.1 HPET Feature ..................................................................................................................... 57
6.7.2 Intel DTS Feature ................................................................................................................ 58
6.8 PnP/PCI Configuration ................................................................................................................ 59
6.8.1 IRQ Resources .................................................................................................................... 60
6.9 PC Health Status ......................................................................................................................... 61
6.10 Load Fail-Safe Defaults ............................................................................................................... 63
6.11 Load Optimized Defaults ............................................................................................................. 63
6.12 Set Password .............................................................................................................................. 63
6.13 Save & Exit Setup ....................................................................................................................... 63
6.14 Exit Without Saving ..................................................................................................................... 63
7 BIOS update ....................................................................................................................................... 64
8 Mechanical Drawing ........................................................................................................................... 65
8.1 PCB: Mounting Holes .................................................................................................................. 65
8.2 PCB: Pin 1 Dimensions ............................................................................................................... 66
8.3 PCB: Heat Sink ........................................................................................................................... 67
9 Technical Data .................................................................................................................................... 68
9.1 Electrical Data ............................................................................................................................. 68
9.2 Environmental Conditions ........................................................................................................... 68
9.3 Thermal Specifications ................................................................................................................ 69
10 Support and Service ........................................................................................................................... 70
10.1 Beckhoff's Branch Offices and Representatives ......................................................................... 70
10.2 Beckhoff Headquarters................................................................................................................ 70
10.2.1 Beckhoff Support ................................................................................................................. 70
10.2.2 Beckhoff Service ................................................................................................................. 70
I Annex: Post-Codes ............................................................................................................................. 71
II Annex: Resources .............................................................................................................................. 74
A IO Range ......................................................................................................................................... 74
B Memory Range ................................................................................................................................ 74
C Interrupt ........................................................................................................................................... 74
D PCI Devices ..................................................................................................................................... 75
E SMB Devices ................................................................................................................................... 75
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