
Inhalt
Seite 4 Beckhoff New Automation Technology CB4051
5.5.1 PCI Express Root Port Function ......................................................................................... 46
5.6 Integrated Peripherals ................................................................................................................. 47
5.6.1 OnChip IDE Devices ........................................................................................................... 48
5.6.2 Onboard Devices ................................................................................................................ 49
5.6.3 SuperIO Devices ................................................................................................................. 50
5.7 Power Management Setup ......................................................................................................... 51
5.8 PnP/PCI Configuration ................................................................................................................ 53
5.8.1 IRQ Resources .................................................................................................................... 55
5.9 PC Health Status ......................................................................................................................... 56
5.10 Frequency/Voltage Control ......................................................................................................... 58
5.11 Load Fail-Safe Defaults............................................................................................................... 59
5.12 Load Optimized Defaults ............................................................................................................. 59
5.13 Set Password .............................................................................................................................. 59
5.14 Save & Exit Setup ....................................................................................................................... 59
5.15 Exit Without Saving ..................................................................................................................... 59
6 BIOS-Update ...................................................................................................................................... 60
7 Mechanische Zeichnung .................................................................................................................... 61
7.1 Leiterplatte: Bohrungen ............................................................................................................... 61
7.2 Leiterplatte: Pin-1-Abstände ....................................................................................................... 62
7.3 Leiterplatte: Heat Sink ................................................................................................................. 63
8 Technische Daten .............................................................................................................................. 64
8.1 Elektrische Daten ........................................................................................................................ 64
8.2 Umgebungsbedingungen ............................................................................................................ 64
8.3 Thermische Spezifikationen ........................................................................................................ 65
9 Support und Service ........................................................................................................................... 66
9.1 Beckhoff-Support ........................................................................................................................ 66
9.2 Beckhoff-Service ......................................................................................................................... 66
9.3 Beckhoff-Firmenzentrale ............................................................................................................. 66
I Anhang: Post-Codes .......................................................................................................................... 67
II Anhang: Ressourcen .......................................................................................................................... 70
A IO-Bereich ....................................................................................................................................... 70
B Memory-Bereich .............................................................................................................................. 70
C Interrupt ........................................................................................................................................... 70
D PCI-Devices .................................................................................................................................... 71
E Ressourcen: SMB-Devices ............................................................................................................. 72
Comentarios a estos manuales